Custom Design RF/EMI Shield, Shield Cans

All kinds of different shield cans for smt board level shielding

Feature: Easy to be tin plated with good shielding effect

Specification: According to customer design/samples

Tooling Type: Progressive Die

Process Type: High/Low speed Wire EDM;

Cleaning Method: Ultrasonic cleaning

Usage: To prevent electromagnetic interference (EMI), shielding the components on the PCB board and LCM.

EMI Shield Products Basic Info

Customized Yes
Process Type Stamping/punching die
Material tinplate steel,nickel silver, stainless steel
Finishing Electroplating: Tin/Nickel/Silver/Gold
Application Mobile phone, Computer, GPS, Watch, Digital Products and other electronic Products. household appliance, automobile, electron,gps, pcb board
Package Polybag, Tray/blister box,Paper, Tape&Reel
 Artwork Design files in STEP,DXF,PDF format.  Put Your Good Ideal into Reality.
Samples Prototypes can be made within 10 days.Bulk Time Around 8-15Working Days.
MOQ It would be great the volume can consume 50KG raw materials.
Payment Term T/T,Paypal, Cash, others can be negotiated.
Shipping By Air/Express or Sea.