Project Description

RF Shield

Custom Design RF/EMI Shield, Shield Cans

All kinds of different shield cans for smt board level shielding

Feature: Easy to be tin plated with good shielding effect

Specification: According to customer design/samples

Tooling Type: Progressive Die

Process Type: High/Low speed Wire EDM;

Cleaning Method: Ultrasonic cleaning

Usage: To prevent electromagnetic interference (EMI), shielding the components on the PCB board and LCM.

EMI Shield Products Basic Info

Process TypeStamping/punching die
Materialtinplate steel,nickel silver, stainless steel
FinishingElectroplating: Tin/Nickel/Silver/Gold
ApplicationMobile phone, Computer, GPS, Watch, Digital Products and other electronic Products. household appliance, automobile, electron,gps, pcb board
PackagePolybag, Tray/blister box,Paper, Tape&Reel
 ArtworkDesign files in STEP,DXF,PDF format.  Put Your Good Ideal into Reality.
SamplesPrototypes can be made within 10 days.Bulk Time Around 8-15Working Days.
MOQIt would be great the volume can consume 50KG raw materials.
Payment TermT/T,Paypal, Cash, others can be negotiated.
ShippingBy Air/Express or Sea.